The study of the cutting phenomenon by visualization of orthogonal cutting behavior
Released on J-STAGE: August 11, 2006 | Volume 49 Issue 1 Pages 24-29
Takuya TAKESHIMA, Noboru MORITA, Shigeru YAMADA, Noboru TAKANO, Tatsuo OYAMA
Precision laser slicing technology for single-crystal SiC wafer
Released on J-STAGE: May 08, 2021 | Volume 64 Issue 12 Pages 635-642
Yohei YAMADA, Tomohiro IKEDA, Junichi IKENO
Influence of wheel-workpiece speed ratio of turn grinding on grinding force and surface roughness
Released on J-STAGE: December 17, 2020 | Volume 64 Issue 4 Pages 201-207
Ryo YAMAZAKI, Minoru OTA, Kai EGASHIRA, Keishi YAMAGUCHI
Precision laser slicing technology for single crystal SiC wafers
Released on J-STAGE: March 01, 2022 | Volume 65 Issue 10 Pages 549-555
Yohei YAMADA, Tomohiro IKEDA, Satomi KOMATSUZAKI, Junichi IKENO
Development of high-efficient CMP process of SiC wafers for power electronics
Released on J-STAGE: November 25, 2016 | Volume 60 Issue 8 Pages 454-459
Shinya HIRANO, Kenji KAWATA, Hirokuni ASAMIZU, Tomohisa KATO
Already have an account? Sign in here